When companies release their flagship
devices around the same time every year,
we often see leaks and rumors surface a
few months beforehand. It’s about that
time of year to already start talking about
the follow up to HTC‘s most recent
flagship, the One M8 . We’ve heard a few
rumors over the past few weeks about the
upcoming flagship, mainly from @upleaks .
We’re now hearing yet another update
from the leaker, and this time it outs the
device’s processor and dimensions.
The new rumor specifies that HTC’s Hima
device will use a Qualcomm Snapdragon
810 processor, featuring two separate quad-
core processors, clocked at 2GHz and
1.5GHz. The device will measure 144.3 x
69.4 x 9.56 mm. When compared to the
One M8, the Hima will be ever-so-slightly
smaller according to the leaks.
Although we don’t know how much the
device weighs or the materials it’s made
with, we do know quite a bit more about
the device, according to the rumor. Along
with the specs listed above, the device will
have a 5-inch 1080p display, 3GB of RAM,
a 20.7MP rear-facing camera, either a
13MP or 4MP UltraPixel front camera and
a 2840mAh battery. The device will also be
available in Gray, Silver, Gold and
Gunmetal Gold, and will run HTC’s Sense
7.0 software atop Android 5.0 Lollipop. It’s
rumored to launch in March of 2015, so be
on the look out for more info on this
upcoming HTC flagship.
Now, remember: all of these specifications
are rumored, so be sure to take these with
a grain of salt. They do, however, all seem
like worthy upgrades to the One M8’s
current specifications. Overall, how do you
feel about the rumored specs so far? Are
these getting you more excited for HTC’s
upcoming flagship? Let us know your
thoughts.
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